Honor Magic 8: As per reports, Honor is developing the flagship Magic 8 series of phones for the Chinese market. By the end of September, flagship phones with the Snapdragon 8 Elite 2 are expected to be available in China. As a result, September is expected to see the release of the Magic 8 series, which will likely include the mentioned chipset.

The leak claims that the purported Honor Magic 8 will have a flat 6.58-inch display with 2.5D glass and 1.5K resolution. Slim bezels and large-radius edges will be features of the screen design. Recall that the tipster had already stated that the black border would be thinner than 1 mm. As to the latest leak, an ultrasonic in-display fingerprint sensor will be included into the screen.

Also, the device is expected to have an IP68/69 rating for dust and water resistance and allow wireless charging. It is interesting to note that the present prototype unit reportedly has a periscope telephoto camera, suggesting that even the ordinary form has sophisticated imaging capabilities. A 3x telephoto camera was part of the Honor Magic 7’s back camera setup from last year, in case you forgot.

The tipster states that the “core specs are decent,” implying a flagship-level performance package that most likely includes a Snapdragon 8 Elite 2 processor, but the complete hardware specifications have not yet been confirmed.

The Snapdragon 8 Elite 2 is expected to go on sale at the end of September this year. By the end of September, the Honor Magic 8 series with the upgraded processor is expected to make its debut in China as well. There is currently no information available on the worldwide release of the Honor Magic 8 series.